STUDY OF ADHESION PROPERTIES IN SINTERED LAYERS OF SILVER PASTES

Nishchev Konstantin Nikolaevich, Сandidate of physical and mathematical sciences, associate professor, director of the Institute of physics and chemistry, Ogarev Mordovia State University (68 Bolshevistskaya street, Saransk, Russia), nishchev@inbox.ru
Novopol'tsev Mikhail Il'ich, Сandidate of physical and mathematical sciences, associate professor, sub-department of general physics, Ogarev Mordovia State University (68 Bolshevistskaya street, Saransk, Russia), nishchev@inbox.ru
Sigachev Aleksandr Fedorovich, Leading engineer, sub-department of solid state physics, Ogarev Mordovia State University (68 Bolshevistskaya street, Saransk, Russia), siaf@mail.ru
Mishkin Vladimir Petrovich, Leading engineer, sub-department of general physics, Ogarev Mordovia State University (68 Bolshevistskaya street, Saransk, Russia), siaf@mail.ru
Grishanin Aleksey Vladimirovich, Junior researcher, sub-department of semiconductor materials and devices, Ogarev Mordovia State University (68 Bolshevistskaya street, Saransk, Russia), grav82@list.ru

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Background. Reliability of power semiconductor devices can be improved by a technology of bonding its components using silver-containing pastes (SP). The purpose of this paper is to study the influence of SP sintering modes on the adhesion strength of these bondings.
Results. With application of L-peel test and REM the authors investigated the impact of compaction temperature and pressure on the adhesive strength of an SP layer being in contact with a molybdenum temperature compensator and a testing strip.
Conclusions. Adhesion properties of the SP sintered layer on the surface of the molybdenum temperature compensator depend on the even distribution of the paste coating and the evenness of pressure compaction. The adhesion strength of bondings is maximum if the process of low temperature SP sintering is carried out at the highest values of pressure and temperature in the given variation range of the said values.

power semiconductor devices, silver-containing paste, lowtemperature sintering, adhesion, L-peel test.

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